With rapid progress of semiconductor devices toward high integrated circuit, manufacturers have entered a period of tough competition to develop ULSI, bringing no fewer than 2.56 Mbit or 1 Gbit into view.
Device surfaces are multilayered with wiring layers (metal film), barrier layers. dielectric layeres (oxide film) and poly silicons. Today, the design rulu of ULSI over 1 Gbit which needs to be more than a double or triple layer-structure, has been miniaturized to as narrow as 0.10μm Planarization of such multilayered film continues to be even more important and indispensable to keep with the actual advancement of the steppers toward high efficiency depth of focus. The Model LGP-612 is purposely designed to not only suit best for the evaluation of CMP pads and slurries, but also suit for the planarization R & D of various devices, LGP-612 equipped with two polishing heads accommodating wafers of Φ4"～Φ8", and allowing in-situ pad conditioning during CMP process is a CMP machine for R & D to boost development of high precision technologies.

1.High-precision and high-rigidity spindl

High precision CMP polishing has become possible with the introduction of the reinforcrd high-sigid spindle that resists the offset lord, and the subsequent minimization of the siderunout of the polishing plate that is considered most critical in CMP process.

2.Polishing plate

Polishing plate is made of super-flat alumina ceramics, which minimizes deformation or warp that may be induced by the thermal expansion. The polishing plate is easily replaced in one touch, and reduces the cost of consumables if a spare plate is used.

The polishing head is provided with two axises, which enables either a dual processing of two works or in-line dressing with a work on one axis and a dresser on the other. The air bag and the gel sealed head system of Lapmaster genuin.

3.Polishing head

The polishing head, that is also easily replaced in one touch, can accommodate Φ4". 6" and 8"wafers.The equipping of a low friction cylinder in it has improved the sticking slip of pressurization.

4.Oscillation

The high-precision and high-rigidity LM guide has reduced stick slip that may induce uncertain factors during CMP.

5.Double shafts (head) with the positive driving mechanisms

Each axis (head) is mounted with a positive drive mechanism, and (pressure) ansd (r.p.m) can be enterd in each shaft independently through its respective touch pane.

6. Processing recipe

With the multistep structure of the processing recipe the Model LGP-612 is capable of addressing any complicated polishing recipe.