未分類

紛体供給機

モデルAB-Rはラッピング装置の研磨剤タンクに定量の研磨粉を自動供給します。これにより、個人差による研磨紛体量のバラつきを防ぎ、日頃の手間を省く事が可能となりました。

ラッピング加工に於ける廃油と汚泥スラッジを分離して、クリーン化された廃油のみをラッピング装置の研磨剤タンクに戻し、リサイクルします。

汚泥スラッジはコンベアとカレンダータイマーによって定期的に排出されます。

クリーン化した廃油が研磨剤タンクに戻るときに新たな研磨粉が研磨剤タンクに供給されて、研磨剤タンク内は一定の濃度を保つことが可能となります。

AB R image

AB R

ポータブルフェーシングユニット

 

ポータブルフェーシングユニット定盤平坦度修正機は手軽に持ち運べて卓上ラップ盤等

フェーシング機構を備えていないラップ盤に簡単にマウントして、ラップ定盤の平坦度修正を行う事が出来ます。

操作も至って簡単で、ダイヤモンドバイトを取り付けて、前進/後退ボタンを押すのみです。

また、ラップ定盤とにポータブルフェーシングユニットを平行に調整するアジャスター機構も備えておりますので、ラップ定盤の傾きも自由自在です

 

portable fecing unit

 

 

卓上式ラッピング装置

 

LJ 15 D2

ー主な仕様ー

  • 定盤径:Φ380㎜
  • 修正リング内径:Φ138㎜
  • 強制ドライブ駆動:2~3軸
  • プロセスタイマー
  • 研磨剤供給機器
  • 研磨剤攪拌機器
  • 寸法:W620mm×D600mm×H480mm
  • 重量:65Kg
  • ユーティリティ:200V 50/60Hz 10KVA 

ラッピング定盤加工サービス

 

当社専用の加工装置でお客様要求仕様に合わせてお仕上げいたします。

 

Copper platebit

 

ダイヤモンドラッピング加工で使用する金属定盤等、お客様の仕様に合わせてV溝、凹溝形状の加工を致します。

 



 

 

Products

The need for greater precise surface finishing grows as well. Today, many conventional machining techniques simply aren't accurate enough to meet such requirments.
Yet, this is where Lapmaster -and its 50 years of experience in precision surfacing with abrasive media-comes in.
Our technological and international expertise makes us a unique partner for providing customized, turnkey precision surfacing solutions utilising the latest conventional and superabrasive techniques.
Whether your requirement is precision sizing, flatness  parallelism or surface finishing,
Lapping Polishing Machines CMP Machines for R&D Purpose
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Dual Face Fine Grinding Machines Optical Polishing Machines
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Wafer Flatness Measuring Device for Bare Wafer Wafer fax mounting Machines
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Accessories & Consumables  
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>> consumables

Accessories

 img01   LapJapan offers an entire line of lapping and poplishing to serve nearly every applications. From hand lapping and polishing palates.
Lapmaster is your "one-stop shop" for all of your lapping and polishing needs.

Hand Lapping and Polishing Plates
Standard Hnad Lapping Plates -
LapJapan Hand Lapping Plates are ideal for research and development work and low volume production where extreme flatness is required. These plates are manufactured from a dense, low porosity cast alloy to insure maximum cutting action, minimum plate wear, and consistent sur face finish.

They are available in three standard sizes of 6" 12" and 18" with crosshatch, serrated or solid surface.
Alloy Polishing Plate -
These plates have a cast base surface with a special alloy to insure minimum plate wear. LapJapan Alloy Polishing Plates are recommended for soft materials such as carbon and plastic. LapJapan Alloy Polishing Plates are available in 6" and 12" diameter.

Ceramic Hand Polishing Plates -
LapJapan Ceramic Polishing Plates are specially designed for use with ceramic, and ferrite materials. These plate are made of solid ceramic (15/16") and are available in 6". 9" and 12" diameter.
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>> Accessories

consumables

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Wafer Flatness Measuring Device for Bare Wafer

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All the sensore carried in MICRO GRANITE equipment are standard goods marketed.
If you specify the characteristics to be inspected and the sensor which a customer need, it will include in MICRO GRANITE equipment (X Y Z and turn axis)and a program will be manufactured.
 table

The DLW 300 is a multifunctional measuring device for any wafer.
It is capable of measuring thickness and flatness using two opposed spectral-interference laser displacement meter.
In order to minimize any shaking occuring during measurement, the Y-axis (front-back axis) and θ-axis  (rotational axis) of this device feature high-precision air bearings utilizing black granite from India, which ensures accurate detection of wafer thickness.

By analyzing data exported to computer, the DEW 300 Iis capable of assessing geometrical factors such as global flatness, warp, sori, and edge roll-off.
Please note: To measure thickness, this device requires a mirrored surface with wafer surface roughness of around #2000 mesh or greater.

Optical Polishing Machines

Lapmaster produces a wide range of air bearing spindle and conventional belt -drive optical polishing machine for use in both plano optics production and R&D environments.

The air bearing line of optical polishers, available with 36" and 48" diameter pitch laps, are designed so that the pich lap and support plate ride on a very thin cushion of compressed air. These machines are driven from an electric motor via a lay shaft, and power is transferred to the lap using a multi-vee drive belt around the circumference of the support plate. This unique design virtually elimminates vibration at the polishing surface and dramatically improves component flatness and finish results.

The conventional belt-driven line of ptich polishers, available with 60",70",84" and 120" diameter pitch laps, are built on a cruciform-shaped structual steel base. The mechanical reduction gearbox and motor are mounted to the side of the polishing plate. The polishing plate is supported by a graphite support plate turning on a heavy duty bearing. Power is transmitted via a flat belt, and the moving parts of the system are enclosed within a panel-clad base.This innovatie polishing plte support design prevents plate deflection common on very large continuous polishers. Isolation of the motor and geabox also help to virtually eliminate vibration at polishing surface.

Standard Features
・Rigid structual steel base.
・Water-cooled pitch lap
・Electronic variable speed drivepitch lap
・Friction drive glass faced workholder rings with VSD
・Friction drive conditioner with VSD
・Peristaltic pump slurry feed system
・Pitch trimming bar (manually operated)
・Automatic, digital cycle timer
・Eccentric, oscillating glass faced workholder ring assemblies (air bearing models only)
・Glass disc-faced conditioner
・Various voltages 50/60Hz, 3phase supply to customer specification

Standard Tooling
・Three high density cast aluminium workholder rings
・Three MICARTA workholder discs
・Start sample of Lapmaster cerium oxide
・Operation manual

Available Option
・Programmable PLC control
・Suspended non-contacting workholder rings
・Recirculating feed system with temperature control
・Eccentric, oscillating workholder ring assemblies
(conmentional nodels only)
・Automatic pitch trimmer
・Machine to suit electrical support plate
・pH and/or temperature monitors

optical

Dual Face Grinding Machine System

MODEL DSG720-DUAL FACE FINE GRINDING MACHINE



MODEL DSG1240-DUAL FACE FINE GRINDING MACHINE



CMP R&D

MODEL LC15" 1Polishing head   MODEL LC15" 2Polishing head    

The Model LC-15S-Ⅰ&Ⅱ has gained most popularity lapping/polishing machie among polishing research laboratories. It has been also widely accepted by the automobile, space -related, engineering and electron-related industries to be used in the front process of the iltra-precision processing. LGP-15S make it possible to improve processing efficiency and lower the processing costs.

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MODEL:LC-700-2 Axis  

With rapid progress of semiconductor devices toward high integrated circuit, manufacturers have entered a period of tough competition to develop ULSI, bringing no fewer than 2.56 Mbit or 1 Gbit into view.
Device surfaces are multilayered with wiring layers (metal film), barrier layers. dielectric layeres (oxide film) and poly silicons. Today, the design rulu of ULSI over 1 Gbit which needs to be more than a double or triple layer-structure, has been miniaturized to as narrow as 0.10μm Planarization of such multilayered film continues to be even more important and indispensable to keep with the actual advancement of the steppers toward high efficiency depth of focus. The Model LGP-612 is purposely designed to not only suit best for the evaluation of CMP pads and slurries, but also suit for the planarization R & D of various devices, LGP-612 equipped with two polishing heads accommodating wafers of Φ4"~Φ8", and allowing in-situ pad conditioning during CMP process is a CMP machine for R & D to boost development of high precision technologies.



1.High-precision and high-rigidity spindl

High precision CMP polishing has become possible with the introduction of the reinforcrd high-sigid spindle that resists the offset lord, and the subsequent minimization of the siderunout of the polishing plate that is considered most critical in CMP process.

2.Polishing plate

Polishing plate is made of super-flat alumina ceramics, which minimizes deformation or warp that may be induced by the thermal expansion. The polishing plate is easily replaced in one touch, and reduces the cost of consumables if a spare plate is used.

The polishing head is provided with two axises, which enables either a dual processing of two works or in-line dressing with a work on one axis and a dresser on the other. The air bag and the gel sealed head system of Lapmaster genuin.

3.Polishing head

The polishing head, that is also easily replaced in one touch, can accommodate Φ4". 6" and 8"wafers.The equipping of a low friction cylinder in it has improved the sticking slip of pressurization.


4.Oscillation

The high-precision and high-rigidity LM guide has reduced stick slip that may induce uncertain factors during CMP.

5.Double shafts (head) with the positive driving mechanisms

Each axis (head) is mounted with a positive drive mechanism, and (pressure) ansd (r.p.m) can be enterd in each shaft independently through its respective touch pane.

6. Processing recipe

With the multistep structure of the processing recipe the Model LGP-612 is capable of addressing any complicated polishing recipe.

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Lapping / Poliching Machines

Lapmaster is unique. It's in a class by itself for true loose abrasive cutting action. It's a big money-saver, too.
The Lapmaster process is a batch loading system,  resulting in high  volumes at parts processed simultaneously. This in creased production capability  reduces piece part costs significantly.
Results of the Lapmaster process are optically flat surfaces and microinch finishes with unfailing uniformity. Part  after part. Production runs on small quantities. Semi or total automation. Lapmaster-prepared  surfaces are flat and scratch...always.
Proper balance of stock removal, finish and flatness are achieved with all of the 13 standard Lapmaster in bench and floor standing models.
Results without comparison or compromise... the Lapmaster way. Lapmaster results are obtained in all types or industries.
The Lapmaster process is producing results in the most sophisticated high technology industries and in job shops... and just about any type and size operation in between. Automotive and aerospace. Pumps and computers.
Diesel engines and compressors.
Opticalproducts and electronics.
Wherever precision flatness and finish are mandatory, Lapmaster dose the job best and most cost-effectively. Industries coast-to coast look to this process for extremely accurate size and parallelity control, plus scratch-free, high-polished parts that fulfill requirements for the stricts specifications and most rigid tolerace requirements.

 

Lapmaster Bench-Top Machines
12" System   15" System
12-system   15-system
     
Model 20   Model 20"w / Pnematic Lifts
model20   model20w

 

Medium-Sized Floor Standing OF Systems
Model 24   Model 36
  model36
     
Model 48   Model 56
model48   model56

 

Medium-Sized Floor Standing PL Machines
Model 24   Model 36
 PL-model24    PL-model36
     
Model 48   Model 56
PL-model48   PL-model56

 

Floor-Standing Single-Side Machines Featuring Menu-Driven PLC with Touch-Screen HMI
Model 48 O/F   Model 36 P/L w/Guarding&Direct Ring Drive   Model 56 P/L
 ss-model48    ss-model36    ss-model56

フッターリンク(日本語版)

ラッピング、ポリシング装置の設計&販売 
ラップジャパン株式会社(旧社名 ラップマスタージャパン㈱)

〒101-0025 東京都千代田区神田佐久間町2-13 FTビル5階
TEL:03-3863-6617 FAX:03-3863-6607

管理者ログイン


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