The DLW 300 is a multifunctional measuring device for any wafer.
It is capable of measuring thickness and flatness using two opposed spectral-interference laser displacement meter.
In order to minimize any shaking occuring during measurement, the Y-axis (front-back axis) and θ-axis  (rotational axis) of this device feature high-precision air bearings utilizing black granite from India, which ensures accurate detection of wafer thickness.

By analyzing data exported to computer, the DEW 300 Iis capable of assessing geometrical factors such as global flatness, warp, sori, and edge roll-off.
Please note: To measure thickness, this device requires a mirrored surface with wafer surface roughness of around #2000 mesh or greater.